DocumentCode
2733281
Title
Size Effects and Temperature Dependence of Stress-Induced Voiding
Author
Hommel, Martina ; Penka, Sabine
Author_Institution
Infineon Technol. AG, Muenchen
fYear
2006
fDate
26-30 March 2006
Firstpage
685
Lastpage
686
Abstract
In this investigation the stress-induced voiding (SIV) behavior of via structures with different geometries was tested. A variation of via sizes, aspect ratios, and widths of connected metal lines was studied. The resistance drift and its temperature dependence behavior showed sensitivity to the structure size. This can be explained by the size-dependence of mechanical stress in the metallization
Keywords
integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; metals; stress effects; interconnect; mechanical stress; metal lines; metallization; resistance drift; size effects; stress-induced voiding behavior; temperature dependence; via structures; Temperature dependence; interconnect; mechanical stress; size effect; stress-induced voiding;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2006. 44th Annual., IEEE International
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9498-4
Electronic_ISBN
0-7803-9499-2
Type
conf
DOI
10.1109/RELPHY.2006.251324
Filename
4017265
Link To Document