DocumentCode
2733578
Title
Surface mounting: experiences in the telecommunication field
Author
Castelli, G. ; Costa, P.
Author_Institution
Telettra SpA, Vimercate, Italy
fYear
1988
fDate
13-15 Jun 1988
Firstpage
66
Lastpage
69
Abstract
The authors´ experience with surface-mounting technology (SMT) is discussed. Vapor phase reflow and wave soldering are considered as well as design rules, printed circuit boards, solder creams, and assembly. Emphasis is given to the correlation between process parameters and yields and it is shown how many standards that are peculiar to through hole mounting result in unacceptable yields for SMT assembly processes
Keywords
soldering; surface mount technology; telecommunication equipment; SMT; assembly; correlation; design rules; printed circuit boards; process parameters; solder creams; standards; surface-mounting technology; telecommunication; through hole mounting; vapour phase reflow; wave soldering; yields; Assembly systems; Circuit testing; Lead; Manufacturing automation; Manufacturing industries; Manufacturing processes; Printed circuits; Soldering; Surface waves; Surface-mount technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International
Conference_Location
Neuilly sur Seine
Type
conf
DOI
10.1109/EEMTS.1988.75956
Filename
75956
Link To Document