Packaging Issues on Combination of LED and Flip Chip

The first practical light emitting diode (LED) was created almost four decades ago. With the explosion of the internet, mobile phones, portable laptop computers, and a myriad of other electronic items, we are now in the middle of an electronic revolution. LED is playing an important role in this revolution because of the numerous fields in which LEDs are used such as lights, displays, projectors, even vision aid, etc. Advances in the development of LEDs have now made LED semiconductor components available across the entire color spectrum. In much the same way as fluorescent lighting forty years ago, LED revolutionizes the entire field of lighting technology. Achieving maximum light yield at minimum production cost is a decisive factor for new low-cost applications. Thus flip chip (FC) technology is attracting rapidly increasing interests from research organizations to relevant companies. Due to flip chip design all electrical contacts are formed in one assembly step and wire bonding isn´t necessary. The second advantage is the good heat transfer that allows high current and therefore high power of the LED. And another advantage of flip chip is that it has a much bigger lighting surface than traditional packaged LEDs, this will make the LEDs hold a high brightness and lighting efficiency.