DocumentCode
2735081
Title
Global Trend in Electronics Manufacturing
Author
Shangguan, Dongkai
Author_Institution
Dr., Flextronics
fYear
2005
fDate
27-29 June 2005
Firstpage
1
Lastpage
3
Abstract
The global trend in electronics manufacturing was reviewed in this paper. First, the global landscape for lead-free soldering and environmental compliance was outlined. This was followed by a discussion of the packaging and assembly technologies in the electronics industry. The impact on the supply chain was also discussed
Keywords
assembling; electron device manufacture; electronic equipment manufacture; electronics industry; electronics packaging; environmental factors; soldering; supply chains; assembly technology; electronics industry; electronics manufacturing global trend; environmental compliance; lead-free soldering; packaging technology; supply chain; Assembly; Consumer electronics; Costs; Electronic waste; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Recycling; Soldering; Supply chains;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on
Conference_Location
Shanghai
Print_ISBN
0-7803-9292-2
Electronic_ISBN
0-7803-9293-0
Type
conf
DOI
10.1109/HDP.2005.251430
Filename
4017471
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