DocumentCode
2739437
Title
The Development of High Speed and Low Loss Materials
Author
Chang, Pifeng ; Chang, Eric ; Liang, Peter ; Lin, Jack
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
174
Lastpage
176
Abstract
In this paper, a microstrip line is used for extracting the frequency dependent material properties such as dielectric constant, attenuation constant, and loss tangent of ten different printed circuit boards (PCBs). Besides the better electric properties, the LD materials with excellent heat resistance can meet high temperature lead free process.
Keywords
dielectric losses; microstrip lines; permittivity; printed circuit testing; printed circuits; PCBs; attenuation constant; dielectric constant; electric properties; heat resistance; high speed material; loss tangent; low loss material; microstrip line; printed circuit boards; Attenuation; Dielectric constant; Dielectric losses; Dielectric materials; Electric resistance; Frequency dependence; Material properties; Microstrip; Printed circuits; Resistance heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Electronic_ISBN
978-1-4244-3624-8
Type
conf
DOI
10.1109/IMPACT.2008.4783837
Filename
4783837
Link To Document