DocumentCode
2739486
Title
Application of wafer direct bonding technology to optical nonreciprocal devices
Author
Mizumoto, Tetsuya ; Takei, Ryohei
Author_Institution
Dept. Electr. & Electron. Eng., Tokyo Inst. of Technol., Tokyo, Japan
fYear
2011
fDate
10-12 Jan. 2011
Firstpage
115
Lastpage
116
Abstract
The wafer direct bonding technology enables one to integrate dissimilar crystals like magneto-optic garnet on Si and III-V semiconductors. Optical nonreciprocal devices are fabricated based on the wafer bonding technology.
Keywords
III-V semiconductors; arsenic compounds; bonding processes; cerium; elemental semiconductors; gallium compounds; garnets; indium compounds; magneto-optical isolators; optical fabrication; optical materials; optical waveguides; silicon; silicon-on-insulator; yttrium compounds; GaInAsP; III-V semiconductors; Si; YIG:Ce; dissimilar crystals; magnetooptic garnet; optical nonreciprocal devices; wafer direct bonding technology; Bonding; Isolators; Magnetooptic devices; Optical device fabrication; Optical interferometry; Optical waveguides; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Winter Topicals (WTM), 2011 IEEE
Conference_Location
Keystone, CO
Print_ISBN
978-1-4244-8428-7
Type
conf
DOI
10.1109/PHOTWTM.2011.5730074
Filename
5730074
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