• DocumentCode
    2739585
  • Title

    Advanced Screen Printing "Practical Approaches for Printable & Flexible Electronics"

  • Author

    Numakura, Dominique

  • Author_Institution
    DKN Res., Haverhill, MA
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    205
  • Lastpage
    208
  • Abstract
    Screen-printing is not a new technology in the printed circuit industry. However, the combinations of new paste materials and an advanced screen-printing process further increases the value of printable flexible electronics that cannot be made by the traditional photolithography process with copper foils. Additionally, more functionality from the circuits will be generated with new materials in the future. The paper shows an example of electronic sensor module made by multiple screen-printing processes with different ink pastes. All passive components of the circuit were formed by the screen-printing process. The new silver paste makes soldering possible directly with the conductor; therefore the active components are assembled by a standard soldering process that is not available for the traditional polymer thick film circuits.
  • Keywords
    electronics packaging; flexible electronics; thick film devices; active components; electronic sensor module; flexible electronics; paste materials; printable electronics; printed circuit industry; screen printing; soldering; Conducting materials; Conductive films; Copper; Flexible electronics; Flexible printed circuits; Ink; Lithography; Printing; Silver; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3623-1
  • Electronic_ISBN
    978-1-4244-3624-8
  • Type

    conf

  • DOI
    10.1109/IMPACT.2008.4783845
  • Filename
    4783845