Simulation and optimization of the package joints in the Quantum well infrared photodetectors Focal Plane Array

Author

Lin, J. ; Guo, F. ; Li, N. ; Zhu, Z.

Author_Institution

East China Normal Univ., Shanghai

fYear

2006

fDate

18-22 Sept. 2006

Firstpage

329

Lastpage

329

Abstract

In hybrid IR FPAs, infrared photodetectors and Si read out integrated circuits (ROICs) are bonded together with indium bumps by flip-chip bonding. The heat-force coupling field of the package joints between infrared photodetectors and ROICs is simulated based on finite-element analysis (FEA) software for finding strain position of the bump and optimizing, and reducing fatigue.

Keywords

electronics packaging; fatigue; finite element analysis; focal planes; infrared detectors; integrated circuit bonding; photodetectors; quantum well devices; readout electronics; silicon; IR FPA; fatigue reduction; finite-element analysis software; flip-chip bonding; focal plane array; heat-force coupling field; indium bumps; package joints; quantum well infrared photodetectors; silicon read out integrated circuits; Analytical models; Bonding; Circuit simulation; Coupling circuits; Hybrid integrated circuits; Indium; Infrared heating; Integrated circuit packaging; Photodetectors; Software packages; FEA; IR FPA; ROIC; fatigue; optimize; stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Infrared Millimeter Waves and 14th International Conference on Teraherz Electronics, 2006. IRMMW-THz 2006. Joint 31st International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0400-2

Electronic_ISBN

1-4244-0400-2

Type

conf

DOI

10.1109/ICIMW.2006.368537

Filename

4222271