• DocumentCode
    2740651
  • Title

    Physical analysis of the high-temperature subthreshold slope in SOI MOSFETs

  • Author

    Rudenko, T. ; Kilchytska, V. ; Colinge, J.P. ; Flandre, B.

  • Author_Institution
    Inst. of Semicond. Phys., NAS of Ukraine, Kyiv, Ukraine
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    34
  • Lastpage
    35
  • Abstract
    Conventional bulk silicon CMOS circuits can operate only at moderate temperatures (up to 150-200°C). At higher temperatures, bulk silicon CMOS devices usually fail because of increased junction leakage, thermally induced latchup, and threshold voltage shift. Thanks to the high-temperature advantages of SOI MOSFETs, the range of SOI CMOS operation can be extended up to 300°C (Francis et al, 1992; Flandre et al, 1993; Eggermont et al, 1996). To better understand device behavior, it is necessary to reconsider the physics of the SOI MOSFET at high temperatures. In this work, we revise the validity of the classical expression for the subthreshold swing and analyze the physics behind the temperature degradation of the subthreshold slope in both thick- and thin-film SOI MOSFETs
  • Keywords
    MOSFET; high-temperature techniques; leakage currents; semiconductor device measurement; silicon-on-insulator; thermal analysis; 150 to 200 C; 300 C; SOI CMOS operation; SOI MOSFET physics; SOI MOSFETs; Si-SiO2; bulk silicon CMOS circuits; bulk silicon CMOS device failure; device behavior; high-temperature subthreshold slope; junction leakage; moderate temperature operation; physical analysis; subthreshold swing; thermally induced latchup; thick-film SOI MOSFETs; thin-film SOI MOSFETs; threshold voltage shift; Capacitance; Doping; MOSFETs; Microelectronics; Physics computing; Semiconductor films; Silicon; Temperature dependence; Thin film devices; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2000 IEEE International
  • Conference_Location
    Wakefield, MA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-6389-2
  • Type

    conf

  • DOI
    10.1109/SOI.2000.892756
  • Filename
    892756