• DocumentCode
    2740669
  • Title

    [Front cover]

  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Abstract
    Presents the front cover or splash screen of the proceedings.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3623-1
  • Type

    conf

  • DOI
    10.1109/IMPACT.2008.4783904
  • Filename
    4783904
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2740669