DocumentCode
2743266
Title
Multielectrode impedance tuning: reducing noise and improving stimulation efficacy
Author
Ross, J.D. ; Connor, S. M O ; Blum, R.A. ; Brown, E.A. ; DeWeerth, S.P.
Author_Institution
Laboratory for Neuroengineering, Georgia Inst. of Technol., Atlanta, GA, USA
Volume
2
fYear
2004
fDate
1-5 Sept. 2004
Firstpage
4115
Lastpage
4117
Abstract
Multielectrode arrays (MEAs) have emerged as a leading technology for extracellular, electrophysiological investigations of neuronal networks. The study of biological neural networks is a difficult task that is further confounded by mismatches in electrode impedance. Electrode impedance plays an important role in shaping incoming signals, determining thermal noise, and influencing the efficacy of stimulation. Our approach to optimally reduce thermal noise and improving the reliability of stimulation is twofold minimize the impedance and match it across all electrodes. To this aim, we have fabricated a device that allows for the automated, impedance-controlled electroplating of micro-electrodes. This device is capable of rapidly (minutes) producing uniformly low impedances across all electrodes in an MEA. The need for uniformly low impedances is important for controlled studies of neuronal networks; this need will increase in the future as MEA technology scales from tens of electrodes to thousands.
Keywords
bioelectric potentials; electric impedance; microelectrodes; neurophysiology; automated impedance-controlled electroplating; biological neural networks; electrode impedance; extracellular electrophysiology; improved stimulation efficacy; microelectrodes; multielectrode arrays; multielectrode impedance tuning; noise reduction; thermal noise; Circuit noise; Circuit optimization; Contacts; Electrodes; Fasteners; Impedance; Microelectrodes; Noise reduction; Pins; Springs; MEA; electrode; electroplating; impedance;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-8439-3
Type
conf
DOI
10.1109/IEMBS.2004.1404148
Filename
1404148
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