• DocumentCode
    2743662
  • Title

    A Green´s function analysis of Schottky barrier diodes in strip-coupled transversal signal processing architectures

  • Author

    Fliegel, F.M.

  • Author_Institution
    Motorola Gov. Electron. Group, Scottsdale, AZ, USA
  • fYear
    1990
  • fDate
    4-7 Dec 1990
  • Firstpage
    259
  • Abstract
    Theoretical and experimental results on Schottky barrier diodes in strip-coupled transversal signal processing architectures are presented. The need for a semiinsulating substrate for efficient SAW (surface acoustic wave) transduction and effective isolation of active circuit elements from one another, together with the need for high spatial sampling rates, is discussed. In ACT (acoustic charge transport) devices, the SAW used for transport of charge biases these Schottky diodes such that the diodes are laterally isolated from one another. This results in a strong dependence of nonlinear efficiency on both frequency and diode length. Substantial effects of DC bias on diode efficiency, and hence on convolver efficiency, are observed in ACT-based architectures, due to the bias induced by the clocking signal(s) present in such devices
  • Keywords
    Green´s function methods; Schottky-barrier diodes; acoustic signal processing; acoustoelectric devices; piezoelectric transducers; surface acoustic wave devices; ultrasonic delay lines; ultrasonic transducers; ACT devices; ACT-based architectures; Green´s function analysis; Schottky barrier diodes; acoustic charge transport; active circuit elements; convolver efficiency; effective isolation; effects of DC bias; efficient SAW transduction; high spatial sampling rates; nonlinear efficiency; semiinsulating substrate; strip-coupled transversal signal processing architectures; Acoustic devices; Acoustic signal processing; Acoustic waves; Active circuits; Green´s function methods; Schottky barriers; Schottky diodes; Signal sampling; Surface acoustic wave devices; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
  • Conference_Location
    Honolulu, HI
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1990.171364
  • Filename
    171364