Plasma Cladding of Ni60-SiC Cermet Coating on Hot Forging Die

Author

Pan, Chenggang ; Wang, Huachang ; Zhou, Jialin

Author_Institution

Sch. of Mater. Sci. & Eng., Wuhan Univ. of Technol., Wuhan, China

Volume

2

fYear

2010

fDate

5-6 June 2010

Firstpage

12

Lastpage

15

Abstract

In order to satisfy performance and long life requirements for hot forging die, Ni60-SiC cermet coating was prepared on the high speed steel W₆M0₅Cr₄V₂ by plasma cladding technology. Metallurgical bonding coating with enough bonding strength was obtained after optimizing the cladding parameters. The clad coating composition, microstructure, microhardness and thermal physical parameters were analyzed by X-ray diffractometer (XRD), optical microscopy (OPM), microhardness tester, laser thermal constant tester and dynamic thermo-mechanical analysis. The experimental results show that Ni60-SiC cermet coating can greatly improve the hardness of hot forging die surface, and reduce the thermal stress of hot forging die surface. Cladding coating has a very good performance of thermal properties.

Keywords

X-ray diffraction; adhesive bonding; cermets; claddings; forging; hot working; microhardness; nickel compounds; optical microscopy; plasma applications; silicon compounds; thermal stresses; thermomechanical treatment; FeCW₆Mo₅Cr₄V₂; Ni-SiC; OPM; X-ray diffractometer; XRD; bonding strength; cermet coating; dynamic thermomechanical analysis; highspeed steel; hot die forging; laser thermal constant tester; metallurgical bonding coating; microhardness; microstructure composition; optical microscopy; plasma cladding; thermal physical parameters; thermal stress reduction; Bonding; Ceramics; Coatings; Forging; Optical microscopy; Plasmas; Steel; Testing; Thermal stresses; X-ray lasers; FGM; Ni60-SiC; hot forging die; plasma cladding; thermal physical parameter;

fLanguage

English

Publisher

ieee

Conference_Titel

Computing, Control and Industrial Engineering (CCIE), 2010 International Conference on

Conference_Location

Wuhan

Print_ISBN

978-0-7695-4026-9

Type

conf

DOI

10.1109/CCIE.2010.121

Filename

5491970