DocumentCode
2746211
Title
Parameter extractions and a new calibration methodology for MOSFET sensors
Author
Tang, Chun-Pai ; Chung, Hsien ; Chao, Yung-Ching ; Lwo, Ben-Je
Author_Institution
Semicond. Lab., Nat. Defense Univ., Tahsi
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
53
Lastpage
56
Abstract
In this work, we studied the availability of p-type MOSFET with 1 mum channel width and 0.15 mum channel length as a stress sensor. Under mechanical, thermal, and thermo-mechanical coupling effects, parameters of the MOSFET devices were extracted based on a new measurement methodology, and linear relationships between drain current variation and stress and/or thermal effects were obtained. According to the measurement data, the extremely important thermal effect was also noted. It is concluded in this work that the newly experimental design and the extracted parameters are useful for MOSFET stress sensor´s design and applications.
Keywords
MOSFET; calibration; stress effects; thermomechanical treatment; MOSFET stress sensor; calibration methodology; drain current; p-type MOSFET; parameter extraction; size 0.15 mum; size 1 mum; stress effect; thermal effects; thermo-mechanical coupling effects; Calibration; Current measurement; Data mining; MOSFET circuits; Mechanical sensors; Mechanical variables measurement; Parameter extraction; Stress measurement; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3620-0
Electronic_ISBN
978-1-4244-3621-7
Type
conf
DOI
10.1109/EMAP.2008.4784227
Filename
4784227
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