Double Trench Isolation (DTI): A Novel Isolation Technology For Deep-submicron Silicon Devices

Author

Park, T. ; Ahn, S.T. ; Kim, Y.C. ; Lee, J.K. ; Lee, M.Y. ; Lee, J.G.

Author_Institution

Samsung Electronics Co. LTD.

fYear

1993

fDate

17-19 May 1993

Firstpage

137

Lastpage

138

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on

Conference_Location

Kyoto, Japan

Type

DOI

10.1109/VLSIT.1993.760286

Filename

760286

Link To Document