Design, fabrication, and property measurement of a zero-insertion-force (ZIF) MEMS connector

This paper demonstrates on the design, fabrication, and testing of a novel zero-insertion-force (ZIF) MEMS connector. The proposed ZIF MEMS connector can remedy the most of problems of traditional MEMS-based connectors, such as wear, poor signal integrity for high-speed signal transmission, and lack of the latch design. The three-mask and silicon-on-insulator (SOI) wafer are designed for the easy fabrication of the terminals and latches simultaneously. The terminals and latches are actuated by electrostatic force to avoid wearing and kinking during mating. The out-of-plane shape of the terminal is controlled by the thin-film deposition with different levels of residual stress to form hook-like shape. The controlled shape of the terminal can provide a reliable contact at the contact interface. The properties of the ZIF MEMS connector are measured and analyzed, such as out-of-plane shape of the terminal, actuated voltage, contact resistance, and RF characteristics. Potential applications of the ZIF MEMS connector include the fine-pitch high-speed interconnection, 3D re-workable packaging, and the performance enhancement of many existing MEMS connectors.