Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method

Author

Tada, Naoya ; Ezaki, Yusuke

Author_Institution

Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama

fYear

2008

fDate

22-24 Oct. 2008

Firstpage

232

Lastpage

235

Abstract

In this study, cyclic tension tests were carried out under fluctuating temperature condition in order to evaluate the strength of lead-free solder/copper interface. Interface crack was continuously monitored by the direct current potential difference method and the crack area ratio was successfully evaluated by the proposed method. The method could be useful not only for the in situ monitoring of cracks in interface strength tests under fluctuating temperature but also for online and on-chip monitoring of individual interface in the electric packages and various electric connections by designing similar embedded circuits.

Keywords

condition monitoring; copper; cracks; plates (structures); solders; tensile testing; copper plate; cyclic tensile loading; cyclic tension tests; direct current potential difference method; electric connections; electric packages; embedded circuits; fluctuating temperature; interface crack; solder ball; Copper; Environmentally friendly manufacturing techniques; Heating; Lead; Monitoring; Power supplies; Resists; Soldering; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on

Conference_Location

Taipei

Print_ISBN

978-1-4244-3620-0

Electronic_ISBN

978-1-4244-3621-7

Type

conf

DOI

10.1109/EMAP.2008.4784271

Filename

4784271