DocumentCode
2749611
Title
Thermal characteristics of buried resistors
Author
Blanco, Richard ; Mansingh, Vivek
Author_Institution
Hewlett-Packard, Cupertino, CA, USA
fYear
1989
fDate
7-9 Feb. 1989
Firstpage
25
Lastpage
29
Abstract
Finite-element modeling and experiments using an infrared camera were carried out to determine the temperature distribution and hence the power rating of buried resistors. The length-to-width ratio of the buried resistors considered ranged from 1 to 5 while their areas ranged from 0.3 to 20 mm/sup 2/. The power applied to the buried resistor was from about 10 to 500 mW. The results showed that the temperature of the buried resistor increases almost linearly with applied power. The effect of length-to-width ratios is relatively small. The temperature of the buried resistors drops significantly in the presence of copper layers; however, the effect of adding more than one layer of copper is relatively small. An equation for determining the power rating of the resistors based on their area is suggested.<>
Keywords
finite element analysis; infrared detectors; infrared imaging; resistors; temperature distribution; 10 to 500 mW; Cu; IR; buried resistors; finite element modelling; infrared camera; length-to-width ratio; power rating; temperature distribution; thermal characteristics; Cameras; Copper; Electronic circuits; Finite element methods; Heat transfer; Printed circuits; Resistors; Shape; Temperature distribution; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
Conference_Location
San Diego, CA, USA
Type
conf
DOI
10.1109/STHERM.1989.76061
Filename
76061
Link To Document