• DocumentCode
    2749611
  • Title

    Thermal characteristics of buried resistors

  • Author

    Blanco, Richard ; Mansingh, Vivek

  • Author_Institution
    Hewlett-Packard, Cupertino, CA, USA
  • fYear
    1989
  • fDate
    7-9 Feb. 1989
  • Firstpage
    25
  • Lastpage
    29
  • Abstract
    Finite-element modeling and experiments using an infrared camera were carried out to determine the temperature distribution and hence the power rating of buried resistors. The length-to-width ratio of the buried resistors considered ranged from 1 to 5 while their areas ranged from 0.3 to 20 mm/sup 2/. The power applied to the buried resistor was from about 10 to 500 mW. The results showed that the temperature of the buried resistor increases almost linearly with applied power. The effect of length-to-width ratios is relatively small. The temperature of the buried resistors drops significantly in the presence of copper layers; however, the effect of adding more than one layer of copper is relatively small. An equation for determining the power rating of the resistors based on their area is suggested.<>
  • Keywords
    finite element analysis; infrared detectors; infrared imaging; resistors; temperature distribution; 10 to 500 mW; Cu; IR; buried resistors; finite element modelling; infrared camera; length-to-width ratio; power rating; temperature distribution; thermal characteristics; Cameras; Copper; Electronic circuits; Finite element methods; Heat transfer; Printed circuits; Resistors; Shape; Temperature distribution; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE
  • Conference_Location
    San Diego, CA, USA
  • Type

    conf

  • DOI
    10.1109/STHERM.1989.76061
  • Filename
    76061