Surface-machined micromechanical membrane pump

Author

Judy, Jack W. ; Tamagawa, Takashi ; Polla, Dennis L.

Author_Institution

Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

fYear

1991

fDate

30 Jan-2 Feb 1991

Firstpage

182

Lastpage

186

Abstract

An electrostatic micromechanical membrane pump for fluids and gases has been designed and fabricated with a process that is compatible with integrated circuits. The process consists of six photolithography steps and eight low-pressure chemical vapor depositions. No bulk silicon etchants or wafer bonding techniques are used. Each pump consists of an input valve, a pumping membrane, and an output valve. All parts are encapsulated by silicon nitride and are actuated by electrostatic forces. Actuation voltages of approximately 50 V are required for observable valve closure and membrane deflections. Typical gas pumping displacements are between 12 to 640 nL per cycle

Keywords

micromechanical devices; pumps; 50 V; IC compatible process; Si₃N₄ encapsulation; actuation voltages; electrostatic micromechanical membrane pump; fluid pumping; gas pumping displacements; input valve; low-pressure chemical vapor depositions; output valve; photolithography steps; pumping membrane; surface machined micropump; Biomembranes; Chemical vapor deposition; Electrostatics; Etching; Gases; Lithography; Micromechanical devices; Pumps; Silicon; Valves;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1991, MEMS '91, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE

Conference_Location

Nara

Print_ISBN

0-87942-641-1

Type

conf

DOI

10.1109/MEMSYS.1991.114792

Filename

114792