• DocumentCode
    2755840
  • Title

    Co-fireable copper multilayered ceramic substrates

  • Author

    Baba, Yasuyuki ; Higashiyama, Kenji ; Segawa, Shigetoshi ; Ishida, Toru ; Nakatani, Seiichi

  • Author_Institution
    Matsushita-Kotobuki Elecr. Ind. Ltd., Ehime, Japan
  • fYear
    1989
  • fDate
    26-28 Apr 1989
  • Firstpage
    28
  • Lastpage
    31
  • Abstract
    The authors discuss the manufacture of co-fireable copper multilayered ceramic substrates utilizing green-tape technology. The substrates were manufactured using an oxidation-reduction reaction, employing CuO paste as an inner-layer conductor. Two types of substrate materials were developed, a crystallizable glass that has good flexural strength, and an amorphous glass which has a low dielectric constant. The burnout process is performed in air. The reduction process is carried out in a nitrogen atmosphere containing 10% hydrogen in which copper oxide is reduced into copper, and sintering is performed in the nitrogen. Low impedance, migration resistance, and low cost have resulted from the use of a Cu conductor
  • Keywords
    ceramics; copper; glass; integrated circuit manufacture; oxidation; packaging; sintering; substrates; CuO paste; MLC type; N2-H2 atmosphere; amorphous glass; burnout process; cofireable Cu substrate; crystallizable glass; flexural strength; green-tape technology; inner-layer conductor; low dielectric constant; manufacture; multilayered ceramic substrates; oxidation-reduction reaction; sintering; substrate materials; Ceramics; Conducting materials; Copper; Crystalline materials; Crystallization; Dielectric materials; Dielectric substrates; Glass; Manufacturing; Nitrogen;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International
  • Conference_Location
    Nara
  • Type

    conf

  • DOI
    10.1109/IEMTS.1989.76103
  • Filename
    76103