High-accuracy inner lead bonding technique

Author

Ikeya, Yukihiro ; Atsumi, Koichiro ; Kashima, Noriyasu ; Maehara, Yoichiro ; Okano, Keitaro

Author_Institution

Toshiba Corp., Kanagawa, Japan

fYear

1989

fDate

26-28 Apr 1989

Firstpage

69

Lastpage

72

Abstract

Miniaturizing electronic apparatus requires the interconnection of high-pin-count IC dies to finely pitched leads. However, conventional wire bonding does not meet this requirement. Tape automated bonding has been employed to achieve high-pin-count and high-density packaging. A fully automated inner lead bonder has been developed. Using this machine, bonding accuracy and bond strength have been investigated. The results obtained indicate that the bonding accuracy is good and that the bonding condition range is wide. This technique has been applied to LCD display module mass production

Keywords

circuit reliability; integrated circuit manufacture; lead bonding; surface mount technology; LCD display module mass production; SMT; TAB; automatic bonding machine; bond strength; bonding accuracy; finely pitched leads; high density packaging; high-pin-count IC dies; inner lead bonding; interconnection; liquid crystal display fabrication; microassembly; surface mounting; tape automated bonding; Charge coupled devices; Charge-coupled image sensors; Electronics packaging; Flip chip; Gold; Manufacturing; Mass production; Packaging machines; Wafer bonding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International

Conference_Location

Nara

Type

conf

DOI

10.1109/IEMTS.1989.76112

Filename

76112