• DocumentCode
    2758509
  • Title

    Modeling and Evaluating the Performance of the Bufferless Optical Interconnection Network (BOIN)

  • Author

    Qi Xingyun ; Dou Qiang ; Feng Quanyou ; Chen Yongran ; Jun, Wen ; Wenhua, Dou

  • Author_Institution
    Coll. of Comput., Nat. Univ. of Defense Technol., Changsha, China
  • Volume
    2
  • fYear
    2009
  • fDate
    25-26 July 2009
  • Firstpage
    81
  • Lastpage
    85
  • Abstract
    Most of the present optical interconnect networks within the high performance computers require either the buffering and opto-electonic conversion of the data packets or the pre-assigning of the optical path from the source to destination, which to a certain extent influence the performance metrics such as latency and throughput. Aiming at the limitation mentioned above, a hybrid optical-electrical interconnection for high performance computer system named bufferless optical interconnection network (BOIN) is brought forward. Basing on the topology and link control protocol of the BOIN, a performance model is setup. According to this model, the network throughput and delay are analyzed and evaluated. Simulation shows that BOIN has advantages over the other two networks. It can deliver high throughput at low latency, which can well satisfy the need for high performance computing systems.
  • Keywords
    optical interconnections; optoelectronic devices; protocols; BOIN; bufferless optical interconnection network; computing systems; data packets; hybrid optical-electrical interconnection; link control protocol; optical path; opto-electonic conversion; Computer networks; Delay; High performance computing; Measurement; Network topology; Optical buffering; Optical computing; Optical fiber networks; Optical interconnections; Throughput; high performance computer; network performance model; optical interconnection network; performance evaluation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Technology and Computer Science, 2009. ITCS 2009. International Conference on
  • Conference_Location
    Kiev
  • Print_ISBN
    978-0-7695-3688-0
  • Type

    conf

  • DOI
    10.1109/ITCS.2009.155
  • Filename
    5190187