DocumentCode

2760444

Title

Repair Of Flip Chips (dca) On Glass Epoxy Printed Circuit Boards

Author

Miller, Denny ; Gregorich, Tom ; Hoang, Hoang ; Mok, Swee

fYear

1993

fDate

9-11 Jun 1993

Firstpage

191

Lastpage

191

Keywords

Assembly; Cost function; Driver circuits; Glass; Manufacturing; Packaging; Printed circuits; Robustness;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN

0-7803-1432-8

Type

conf

DOI

10.1109/IEMT.1993.639749

Filename

639749