• DocumentCode
    2761282
  • Title

    High-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via

  • Author

    Guo, Yong-Xin ; Chu, Hui

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
  • Volume
    1
  • fYear
    2010
  • fDate
    20-23 Sept. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, the through silicon via (TSV) technology is employed to design millimeter-wave substrate integrated waveguide (SIW) based on-chip antennas. The TSV based SIW is first characterized with different silicon resistivity, substrate thickness and via pitch size. Then a high-efficiency TSV based SIW antenna is demonstrated.
  • Keywords
    millimetre wave antennas; monolithic integrated circuits; substrate integrated waveguides; waveguide antennas; SIW antenna; TSV technology; millimeter wave substrate integrated waveguide; silicon on-chip antennas; silicon resistivity; through silicon via technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultra-Wideband (ICUWB), 2010 IEEE International Conference on
  • Conference_Location
    Nanjing
  • Print_ISBN
    978-1-4244-5305-4
  • Electronic_ISBN
    978-1-4244-5306-1
  • Type

    conf

  • DOI
    10.1109/ICUWB.2010.5615804
  • Filename
    5615804
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2761282