• DocumentCode
    2761772
  • Title

    Creep in photovoltaic modules: Examining the stability of polymeric materials and components

  • Author

    Miller, David C. ; Kempe, Michael D. ; Glick, Stephen H. ; Kurtz, Sarah R.

  • Author_Institution
    Nat. Renewable Energy Lab. (NREL), Golden, CO, USA
  • fYear
    2010
  • fDate
    20-25 June 2010
  • Abstract
    Interest in renewable energy has motivated the implementation of new polymeric materials in photovoltaic modules. Some of these are non-cross-linked thermoplastics, in which there is a potential for new behaviors to occur, including phase transformation and visco-elastic flow. Differential scanning calorimetry and rheometry data were obtained and then combined with existing site-specific time-temperature information in a theoretical analysis to estimate the displacement expected to occur during module service life. The analysis identified that, depending on the installation location, module configuration and/or mounting configuration, some of the thermoplastics are expected to undergo unacceptable physical displacement. While the examples here focus on encapsulation materials, the concerns apply equally to the frame, junction-box, and mounting-adhesive technologies.
  • Keywords
    creep; differential scanning calorimetry; non-Newtonian flow; photovoltaic cells; polymers; renewable energy sources; creep; differential scanning calorimetry; encapsulation materials; installation location; module configuration; module service life; mounting configuration; mounting-adhesive technologies; noncross-linked thermoplastics; phase transformation; photovoltaic modules; polymeric components; polymeric materials; renewable energy; rheometry data; site-specific time-temperature information; unacceptable physical displacement; viscoelastic flow;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
  • Conference_Location
    Honolulu, HI
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-5890-5
  • Type

    conf

  • DOI
    10.1109/PVSC.2010.5615832
  • Filename
    5615832