DocumentCode
2762642
Title
Package Deformation And Cracking Mechanism Due To Reflow Soldering
Author
Sawada, Kazuaki
fYear
1993
fDate
9-11 Jun 1993
Firstpage
295
Lastpage
298
Keywords
Absorption; Equations; Humidity; Material storage; Moisture measurement; Reflow soldering; Resins; Semiconductor device packaging; Semiconductor devices; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639774
Filename
639774
Link To Document