• DocumentCode
    2763492
  • Title

    Table of contents

  • fYear
    2010
  • fDate
    28-30 Sept. 2010
  • Firstpage
    1
  • Lastpage
    97
  • Abstract
    The following topics are dealt with: filters; metamaterials; wireless sensor network; frequency generation; RF MEMS; 3D integration technology; microwave photonics; EM field theory; directional couplers; power combiners; substrate integrated waveguide; antenna array; biological effects; EM numerical techniques; microwave network analysis; calibration techniques; transceivers; microstrip components; lumped components; passive device modelling; multichip modules; CRLH structures; medical imaging; low noise receiver components; electromagnetic wave propagation; MoM techniques; FEM techniques; envelope tracking power amplifiers; millimetre-wave waveguide transitions; electronics packaging; microwave measurement systems; EBG structures; and electromagnetic compatibility.
  • Keywords
    antenna arrays; biological effects of fields; biomedical imaging; calibration; directional couplers; electromagnetic compatibility; electromagnetic field theory; electromagnetic wave propagation; electronics packaging; filters; finite element analysis; metamaterials; method of moments; micromechanical devices; microwave measurement; microwave photonics; multichip modules; photonic band gap; power amplifiers; power combiners; substrate integrated waveguides; transceivers; 3D integration technology; CRLH structures; EBG structures; EM field theory; EM numerical techniques; FEM techniques; MoM techniques; RF MEMS; antenna array; biological effects; calibration techniques; directional couplers; electromagnetic compatibility; electromagnetic wave propagation; electronics packaging; envelope tracking power amplifiers; filters; frequency generation; low noise receiver components; lumped components; medical imaging; metamaterials; microstrip components; microwave measurement systems; microwave network analysis; microwave photonics; millimetre-wave waveguide transitions; multichip modules; passive device modelling; power combiners; substrate integrated waveguide; transceivers; wireless sensor network;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2010 European
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-7232-1
  • Type

    conf

  • Filename
    5615928
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2763492