• DocumentCode
    2763936
  • Title

    High temperature growth of very high Ge content SiGe virtual substrates

  • Author

    Hartmann, J.M. ; Bogumilowicz, Yann ; Di Nardo, C. ; Holliger, P. ; Rolland, G. ; Papon, A.-M. ; Billon, T.

  • Author_Institution
    CEA-DRT, LETI/D2NT & DPTS, Grenoble
  • fYear
    2006
  • fDate
    15-17 May 2006
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Very high Ge content SiGe virtual substrates (50% les [Ge] les 70%) can serve as templates for the growth of compressively strained Ge (c-Ge) / t-Si dual channels, with impressive hole mobility enhancements (up to 10) over bulk Si based in M. L. Lee and E. A. Fitzgerald (2003) and O. Weber et al. (2005). SiGe virtual substrates graded all the way up to pure Ge according to M. T. Currie et al. (1998) enable the monolithic integration of high performance III-V optical devices (such as p+/ n GaAs solar cells as presented in C. L. Andre et al. (2005), AlGaInP resonant cavity light emitting diodes, etc. as presented in O. Kwon et al. (2005)) on large area Si substrates etc. In this paper, we quantify the evolution of the structural properties of SiGe virtual substrates grown at 850degC in a commercial reduced pressure-chemical vapor deposition tool as a function of the final Ge concentration in the 50% to 100% range
  • Keywords
    Ge-Si alloys; chemical vapour deposition; hole mobility; semiconductor growth; substrates; 850 C; SiGe; high temperature growth; hole mobility enhancements; monolithic integration; optical devices; reduced pressure-chemical vapor deposition; structural properties; virtual substrates; Gallium arsenide; Germanium silicon alloys; III-V semiconductor materials; Light emitting diodes; Monolithic integrated circuits; Optical devices; Photovoltaic cells; Resonance; Silicon germanium; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SiGe Technology and Device Meeting, 2006. ISTDM 2006. Third International
  • Conference_Location
    Princeton, NJ
  • Print_ISBN
    1-4244-0461-4
  • Type

    conf

  • DOI
    10.1109/ISTDM.2006.246607
  • Filename
    1715976