• DocumentCode
    2763951
  • Title

    Influence of soft breakdown on NMOSFET device characteristics

  • Author

    Pompl, T. ; Wurzer, H. ; Kerber, M. ; Wilkins, R.C.W. ; Eisele, I.

  • Author_Institution
    Siemens Semicond. Group, Muenchen, Germany
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    82
  • Lastpage
    87
  • Abstract
    The degradation of important transistor parameters related to soft breakdown and hard breakdown were studied. Long and short channel transistors were homogeneously stressed at elevated temperature until soft breakdown or hard breakdown occurred. The only noticeable signature of soft breakdown is an increase in off current due to enhanced gate induced drain leakage current. This effect arises if the soft breakdown is located within the gate-to-drain overlap region. Soft breakdown generates a spot or path of negative charges in the oxide and therefore enhances gate induced drain leakage current
  • Keywords
    MOSFET; leakage currents; semiconductor device breakdown; semiconductor device reliability; semiconductor device testing; NMOSFET device characteristics; SiO2-Si; gate induced drain leakage current; gate-to-drain overlap region; hard breakdown; homogeneously stressed transistors; long channel transistors; off current; oxide negative charge path; oxide negative charge spot; short channel transistors; soft breakdown; soft breakdown signature; transistor parameters; Breakdown voltage; Current measurement; Degradation; Dielectric measurements; Electric breakdown; Leakage current; MOSFET circuits; Monitoring; Stress measurement; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-5220-3
  • Type

    conf

  • DOI
    10.1109/RELPHY.1999.761596
  • Filename
    761596