DocumentCode
2764218
Title
Modular approach of a high current MOS compact model for circuit-level ESD simulation including transient gate coupling behavior
Author
Mergens, Markus ; Wilkening, Wolfgang ; Mettler, Stephan ; Wolf, Heinrich ; Fichtner, Wolfgang
Author_Institution
Robert Bosch GmbH, Reutlingen, Germany
fYear
1999
fDate
1999
Firstpage
167
Lastpage
178
Abstract
A novel modular strategy for highly flexible modeling of ESD-capable MOS compact models is introduced. These high current MOS models comprise the important gate coupling effect and an approximated formulation for the avalanche multiplication factor. This enormously enhances the computation stability and performance of the model. An easy but accurate parameter extraction procedure is described. Measurement and simulation of an application example employing the new ESD-model within a CMOS output driver exhibit the relevance of dynamic gate coupling for the ESD reliability of the circuit
Keywords
CMOS integrated circuits; MOSFET; avalanche breakdown; circuit simulation; electrostatic discharge; integrated circuit measurement; integrated circuit reliability; protection; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; transient analysis; CMOS output driver; ESD-capable MOS compact models; ESD-model; avalanche multiplication factor; circuit ESD reliability; circuit-level ESD simulation; computation stability; dynamic gate coupling; flexible modeling; gate coupling effect; high current MOS compact model; high current MOSFET models; measurement; model performance; modular strategy; parameter extraction procedure; protection; simulation; transient gate coupling; Circuit simulation; Circuit stability; Computational modeling; Coupling circuits; Electrostatic discharge; Equations; MOSFETs; Protection; Semiconductor device modeling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International
Conference_Location
San Diego, CA
Print_ISBN
0-7803-5220-3
Type
conf
DOI
10.1109/RELPHY.1999.761609
Filename
761609
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