Reliability methodology for prediction of micromachined accelerometer stiction

Author

Hartzell, Allyson ; Woodilla, David

Author_Institution

Div. of Micromachined Products, Analog Devices Inc., Cambridge, MA, USA

fYear

1999

fDate

1999

Firstpage

202

Lastpage

205

Abstract

The accurate prediction of known failure mechanisms is required for success in the integrated circuit marketplace. This study reports an empirically-generated stiction field prediction model methodology for accelerometers prone to stiction failure. A probability distribution function was generated as a function of shock level in g´s. Although the population was all very stiction prone, the failure mode is probabilistic and parts have a high survival rate

Keywords

accelerometers; microsensors; probability; semiconductor device models; semiconductor device reliability; stiction; accelerometers; empirically-generated stiction field prediction model methodology; failure mechanisms; integrated circuit marketplace; micromachined accelerometer stiction; part survival rate; probabilistic failure mode; probability distribution function; reliability methodology; shock level; stiction failure; stiction prediction; stiction prone population; Acceleration; Accelerometers; Capacitive sensors; Electric shock; Failure analysis; Integrated circuit reliability; Mechanical sensors; Mechanical systems; Microscopy; Predictive models;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium Proceedings, 1999. 37th Annual. 1999 IEEE International

Conference_Location

San Diego, CA

Print_ISBN

0-7803-5220-3

Type

conf

DOI

10.1109/RELPHY.1999.761613

Filename

761613