DocumentCode
2764731
Title
Growth Kinetics of Si and SiGe on Si
Author
Hartmann, J.M. ; Burdin, M. ; Rolland, G. ; Billon, T.
Author_Institution
Centre d´Etudes Atomiques, Grenoble
fYear
2006
fDate
15-17 May 2006
Firstpage
1
Lastpage
2
Abstract
We propose in this paper a detailed study of the growth kinetics of Si and SiGe in reduced pressure chemical vapor deposition on Si(100), Si(110) and Si(111) substrates. The gaseous chemistry used, dichlorosilane (SiH2Cl2) + germane (GeH4) + hydrochloric acid (HCl), is selective versus SiO2 and Si3N4. One should thus greatly benefit from such data when growing selectively either recessed SiGe sources and drains or Si raised sources and drains in the active regions of (110) pMOSFETs, when depositing SiGe in the (111) grooves of V-MOSFETs, when growing Si or SiGe on the (110) sidewalls of FinFETs etc
Keywords
Ge-Si alloys; chemical vapour deposition; germanium compounds; silicon compounds; surface morphology; FinFET; GeH4; Si3N4; SiGe; SiH2Cl2; SiO2; V-MOSFET; growth kinetics; pMOSFET; reduced pressure chemical vapor deposition; Chemical vapor deposition; Chemistry; Distributed control; Germanium silicon alloys; Hydrogen; Kinetic theory; Paper technology; Silicon germanium; Temperature dependence; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
SiGe Technology and Device Meeting, 2006. ISTDM 2006. Third International
Conference_Location
Princeton, NJ
Print_ISBN
1-4244-0461-4
Type
conf
DOI
10.1109/ISTDM.2006.246520
Filename
1716014
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