• DocumentCode
    2764731
  • Title

    Growth Kinetics of Si and SiGe on Si

  • Author

    Hartmann, J.M. ; Burdin, M. ; Rolland, G. ; Billon, T.

  • Author_Institution
    Centre d´Etudes Atomiques, Grenoble
  • fYear
    2006
  • fDate
    15-17 May 2006
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We propose in this paper a detailed study of the growth kinetics of Si and SiGe in reduced pressure chemical vapor deposition on Si(100), Si(110) and Si(111) substrates. The gaseous chemistry used, dichlorosilane (SiH2Cl2) + germane (GeH4) + hydrochloric acid (HCl), is selective versus SiO2 and Si3N4. One should thus greatly benefit from such data when growing selectively either recessed SiGe sources and drains or Si raised sources and drains in the active regions of (110) pMOSFETs, when depositing SiGe in the (111) grooves of V-MOSFETs, when growing Si or SiGe on the (110) sidewalls of FinFETs etc
  • Keywords
    Ge-Si alloys; chemical vapour deposition; germanium compounds; silicon compounds; surface morphology; FinFET; GeH4; Si3N4; SiGe; SiH2Cl2; SiO2; V-MOSFET; growth kinetics; pMOSFET; reduced pressure chemical vapor deposition; Chemical vapor deposition; Chemistry; Distributed control; Germanium silicon alloys; Hydrogen; Kinetic theory; Paper technology; Silicon germanium; Temperature dependence; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SiGe Technology and Device Meeting, 2006. ISTDM 2006. Third International
  • Conference_Location
    Princeton, NJ
  • Print_ISBN
    1-4244-0461-4
  • Type

    conf

  • DOI
    10.1109/ISTDM.2006.246520
  • Filename
    1716014