DocumentCode
2765105
Title
Multifactor-surface-tests of organic insulating materials in the early stage of degradation
Author
Kloes, H.J. ; Koenig, D.
Author_Institution
High Voltage Lab., Tech. Hochschule Darmstadt, Germany
Volume
1
fYear
1996
fDate
16-19 Jun 1996
Firstpage
296
Abstract
Ageing due to multifactor stresses of the surface of organic materials has to be divided into two different stages named “early” and “late” stage of ageing. While standardized tests such as the inclined plane test or the rotating wheel dip test aim at verifying only the performance of insulating materials in the late stage of ageing, growing interest of scientists recently focuses on the early stage of ageing, characterized by a loss of hydrophobicity and an increase of leakage current as well as the appearance of surface partial discharges. To assess the phenomena in the early stage of ageing several new test facilities and diagnostic tools have been developed and applied, such as the “inverse” climatic chamber generating continuous condensation, the cold fog chamber and the “modified” rotating wheel dip test arrangement. This paper presents some new test results of polymer resin materials achieved in above mentioned test facilities and enables a comparison and assessment of the efficiency and the advantages of relevant test procedures
Keywords
ageing; electric breakdown; insulator contamination; insulator testing; organic insulating materials; partial discharges; polymer insulators; surface discharges; cold fog chamber; diagnostic tools; early ageing state; hydrophobicity loss; inverse climatic chamber; leakage current; modified rotating wheel dip test; multifactor surface tests; organic insulating materials; polymer insulator testing; polymer resin materials; surface partial discharges; test facilities; test procedures; Aging; Insulation; Leakage current; Materials testing; Organic materials; Performance loss; Stress; Surface discharges; Test facilities; Wheels;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 1996., Conference Record of the 1996 IEEE International Symposium on
Conference_Location
Montreal, Que.
ISSN
1089-084X
Print_ISBN
0-7803-3531-7
Type
conf
DOI
10.1109/ELINSL.1996.549340
Filename
549340
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