DocumentCode
2765288
Title
Fine Pitch Tab-lsi Interconnection Technology In MCM
Author
Mori, Fumio ; Kudo, Kiyofumi ; Tsukamoto, Kenji
fYear
1993
fDate
9-11 Jun 1993
Firstpage
366
Lastpage
369
Keywords
Bonding; Ceramics; Electronics packaging; Integrated circuit interconnections; Large scale integration; Logic; Pins; Polyimides; Space technology; Supercomputers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639808
Filename
639808
Link To Document