DocumentCode
2765450
Title
Antenna in HSBGA package for 2.4 GHz WLAN application
Author
Lu, Tzu-Hao ; Yeh, Shih-Huang ; Tang, Chia-Lun
Author_Institution
Ind. Technol. Res. Inst., Hsinchu
fYear
2006
fDate
12-15 Dec. 2006
Firstpage
2017
Lastpage
2019
Abstract
A novel AiP(antenna in package) technology has been proposed. The antenna apparatus, which has a heat dissipation function and characteristic of radiation at the same time, can be realized by simply cutting and bending a metal plate and implemented it with standard package process that is very useful for mass production. As the demands of the integration increase, it is inevitable to integrate the antenna into the same RF FEM (front end module) package to achieve total RF system in single package.
Keywords
antennas; cooling; wireless LAN; RF front end module package; antenna apparatus; antenna in package technology; frequency 2.4 GHz; heat dissipation function; wireless LAN; Antenna accessories; Antenna feeds; Antenna measurements; Bandwidth; Circuit simulation; Microwave technology; Packaging; Radio frequency; Space heating; Wireless LAN; FEM; PIFA; Package; WLAN; Wi-Fi;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2006. APMC 2006. Asia-Pacific
Conference_Location
Yokohama
Print_ISBN
978-4-902339-08-6
Electronic_ISBN
978-4-902339-11-6
Type
conf
DOI
10.1109/APMC.2006.4429806
Filename
4429806
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