• DocumentCode
    2766448
  • Title

    Maskless fabrication of high aspect ratio structures by combination of micromolding and direct drawing

  • Author

    Kim, Jooncheol ; Paik, Seung-Joon ; Wang, Po-Chun ; Kim, Seong-Hyok ; Allen, Mark G.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2011
  • fDate
    23-27 Jan. 2011
  • Firstpage
    280
  • Lastpage
    283
  • Abstract
    This paper presents a fabrication process combining micromolding and direct drawing, and its application to the development of high aspect ratio microneedles. Without using photolithography or etching, the proposed process creates microneedles with: 1) higher aspect ratios than that of the original mold, 2) controllable needle diameter for optimized mechanical strength, and 3) arrowhead-shaped tips for potentially increased capacity and effective payload delivery. The needles presented are formed with biocompatible, water-soluble polymers, but the fabrication process inherently allows many kinds of polymers to be exploited. Various high aspect ratio 3D structures were fabricated and characterized, and the fabrication result was compared with theoretical prediction. Water-soluble microneedle arrays have been fabricated and successfully penetrated into porcine skin, fully releasing the drug-surrogate into the dermis layer within a minute.
  • Keywords
    bioMEMS; biomedical materials; drawing (mechanical); microfabrication; moulding; needles; polymers; solubility; 3D structures; biocompatible water-soluble polymers; dermis layer; direct drawing; drug surrogate; high aspect ratio structures; maskless fabrication; mechanical strength; micromolding; microneedle arrays; porcine skin; Fabrication; Lithography; Needles; Plastics; Shape; Skin; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
  • Conference_Location
    Cancun
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-9632-7
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2011.5734416
  • Filename
    5734416