DocumentCode
2766459
Title
Micro suction cup array for wet/dry adhesion
Author
Thanh-Vinh, N. ; Takahashi, H. ; Kan, T. ; Noda, K. ; Matsumoto, K. ; Shimoyama, I.
Author_Institution
Univ. of Tokyo, Tokyo, Japan
fYear
2011
fDate
23-27 Jan. 2011
Firstpage
284
Lastpage
287
Abstract
We propose a micro suction cup array for adhesion to both dry and wet surfaces. We measured the peel-off forces of a PDMS micro suction cup array, a PDMS flat-tip micro structure array and a flat PDMS pad from both wet and dry glass surfaces. When the glass surface was wet, the peel-off forces of a PDMS flat-tip micro pattern and a flat PDMS pad decreased by more than 1.7 times and 7.0 times, respectively. On the other hand, peel-off forces of a PDMS micro suction cup array increased by over 1.1 times when the glass surface was wet. Also, in both wet and dry conditions, an array of PDMS micro suction cup adhered stronger to a glass surface than a PDMS flat-tip micro pattern and a flat PDMS pad. Furthermore, we demonstrated that the adhesion of a suction cup array can be enhanced by miniaturizing the size of the cups.
Keywords
adhesion; glass; micromechanical devices; micromechanics; polymers; PDMS microsuction cup array; SiO2; flat-tip micro pattern; glass surface; peel-off force measurement; polydimethylsiloxane; wet-dry adhesion; Adhesives; Arrays; Films; Force; Friction; Glass; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location
Cancun
ISSN
1084-6999
Print_ISBN
978-1-4244-9632-7
Type
conf
DOI
10.1109/MEMSYS.2011.5734417
Filename
5734417
Link To Document