• DocumentCode
    2766459
  • Title

    Micro suction cup array for wet/dry adhesion

  • Author

    Thanh-Vinh, N. ; Takahashi, H. ; Kan, T. ; Noda, K. ; Matsumoto, K. ; Shimoyama, I.

  • Author_Institution
    Univ. of Tokyo, Tokyo, Japan
  • fYear
    2011
  • fDate
    23-27 Jan. 2011
  • Firstpage
    284
  • Lastpage
    287
  • Abstract
    We propose a micro suction cup array for adhesion to both dry and wet surfaces. We measured the peel-off forces of a PDMS micro suction cup array, a PDMS flat-tip micro structure array and a flat PDMS pad from both wet and dry glass surfaces. When the glass surface was wet, the peel-off forces of a PDMS flat-tip micro pattern and a flat PDMS pad decreased by more than 1.7 times and 7.0 times, respectively. On the other hand, peel-off forces of a PDMS micro suction cup array increased by over 1.1 times when the glass surface was wet. Also, in both wet and dry conditions, an array of PDMS micro suction cup adhered stronger to a glass surface than a PDMS flat-tip micro pattern and a flat PDMS pad. Furthermore, we demonstrated that the adhesion of a suction cup array can be enhanced by miniaturizing the size of the cups.
  • Keywords
    adhesion; glass; micromechanical devices; micromechanics; polymers; PDMS microsuction cup array; SiO2; flat-tip micro pattern; glass surface; peel-off force measurement; polydimethylsiloxane; wet-dry adhesion; Adhesives; Arrays; Films; Force; Friction; Glass; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
  • Conference_Location
    Cancun
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-9632-7
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2011.5734417
  • Filename
    5734417