Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: Application to accelerometers

Author

Guo, B. ; Wen, L. ; Helin, P. ; Claes, G. ; Verbist, A. ; Van Hoof, R. ; Du Bois, B. ; De Coster, J. ; De Wolf, I. ; Shahar, A. Hadi ; Li, Y. ; Cui, H. ; Lux, M. ; Vereecke, G. ; Tilmans, H.A.C. ; Haspeslagh, L. ; Decoutere, S. ; Osman, H. ; Puers, R. ; S

Author_Institution

Imec, Leuven, Belgium

fYear

2011

fDate

23-27 Jan. 2011

Firstpage

352

Lastpage

355

Abstract

We present an attractive poly-SiGe thin film packaging and MEM (Micro Electro-Mechanical) platform technology for integrating various packaged MEM devices above standard CMOS. The packages, having cavities as large as 1 mm², make use of pillars designed to withstand subsequent molding during 1^st level packaging. Covers on top of the release holes avoid deposition inside the cavity during sealing. Hermeticity is proven in vacuum, air and N₂ atmosphere and at different temperatures. Packaged functional accelerometers sealed at a pressure around 1 bar, have an equivalent performance in measuring accelerations of about 1 g compared to a piezoelectric commercial reference device.

Keywords

CMOS integrated circuits; Ge-Si alloys; accelerometers; micromechanical devices; piezoelectric devices; wafer level packaging; CMOS technology; MEM device platform technology; SiGe; accelerometer; hermeticity; piezoelectric device; pressure 1 bar; sealing; thin film packaging; Accelerometers; CMOS integrated circuits; Cavity resonators; Micromechanical devices; Packaging; Silicon germanium; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on

Conference_Location

Cancun

ISSN

1084-6999

Print_ISBN

978-1-4244-9632-7

Type

conf

DOI

10.1109/MEMSYS.2011.5734434

Filename

5734434