• DocumentCode
    2768388
  • Title

    Correlation of ramped current to constant voltage gate oxide reliability testing on leading edge DRAM technology

  • Author

    Aichmayr, G. ; Beyer, A.

  • Author_Institution
    Infineon Technol. SC300 GmbH, Dresden, Germany
  • fYear
    2003
  • fDate
    20-23 Oct. 2003
  • Firstpage
    99
  • Lastpage
    100
  • Abstract
    A correlation between ramped current charge to breakdown tests and long term constant voltage measurements was done on scribe line gate oxide test structures on two different sets of hardware. This empirical/statistical approach allows for a quick inline lifetime assessment of hardware avoiding delays due to long term "time to breakdown" measurements. Results based on this instantaneous assessment can trigger fast action and therefore increase cost efficiency.
  • Keywords
    DRAM chips; failure analysis; semiconductor device breakdown; semiconductor device reliability; semiconductor device testing; statistical analysis; DRAM; constant voltage gate oxide reliability testing; hardware avoiding delays; inline lifetime assessment; ramped current correlation; scribe line gate oxide test structures; time-to-breakdown measurements; Breakdown voltage; Costs; Delay effects; Electric breakdown; Hardware; Lead compounds; Random access memory; Testing; Time measurement; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2003 IEEE International
  • Print_ISBN
    0-7803-8157-2
  • Type

    conf

  • DOI
    10.1109/IRWS.2003.1283309
  • Filename
    1283309