• DocumentCode
    2768691
  • Title

    Electromigration discussion group summary

  • Author

    Schafft, Hany A.

  • Author_Institution
    NIST, Gaithersburg, MD
  • fYear
    2003
  • fDate
    20-23 Oct. 2003
  • Firstpage
    151
  • Lastpage
    152
  • Abstract
    Summaries are presented of discussions on the following topics: (A) Non-Damascene Copper Interconnects; (B) Electromigration in Solder Bumps; (C) Stress Voiding; and (D) on AC and Pulsed Electromigration.
  • Keywords
    Aluminum; Copper; Degradation; Dielectric measurements; Dielectric thin films; Electromigration; Etching; Metallization; Stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2003 IEEE International
  • Conference_Location
    Lake Tahoe, CA, USA
  • Print_ISBN
    0-7803-8157-2
  • Type

    conf

  • DOI
    10.1109/IRWS.2003.1283326
  • Filename
    1283326
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2768691