DocumentCode
2770285
Title
High-density pMUT array for 3-D ultrasonic imaging based on reverse-bonding structure
Author
Wang, Yu-Feng ; Ren, Tian-Ling ; Yang, Yi ; Chen, Hao ; Zhou, Chang-Jian ; Wang, Li-Gang ; Liu, Li-Tian
Author_Institution
Inst. of Microelectron., Tsinghua Univ., Beijing, China
fYear
2011
fDate
23-27 Jan. 2011
Firstpage
1035
Lastpage
1038
Abstract
High-density piezoelectric micromachined ultrasonic transducer (pMUT) arrays have been designed and fabricated using silicon based micromachined process. These devices are based on a novel structure called “reverse-bonding”. Experimental results show that they have excellent performance, suitable resonance frequency and high reliability. The fabricated pMUT arrays are very promising for 3-D medical imaging.
Keywords
biomedical transducers; biomedical ultrasonics; micromachining; piezoelectric transducers; silicon; ultrasonic imaging; ultrasonic transducer arrays; 3D medical imaging; 3D ultrasonic imaging; Si; high-density pMUT array; piezoelectric micromachined ultrasonic transducer arrays; reliability; resonance frequency; reverse-bonding structure; silicon-based micromachined process; Arrays; Capacitance; Electrodes; Impedance; Resonant frequency; Silicon; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location
Cancun
ISSN
1084-6999
Print_ISBN
978-1-4244-9632-7
Type
conf
DOI
10.1109/MEMSYS.2011.5734605
Filename
5734605
Link To Document