• DocumentCode
    2772348
  • Title

    Design of a microstrip patch antenna using Low Temperature Co-Fired Ceramic Technology

  • Author

    Natashah, N. Mohd ; Muammar, M.I. ; Soh, P.J. ; Azremi, A.A.H. ; Norhawati, A.

  • Author_Institution
    Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau
  • fYear
    2008
  • fDate
    1-3 Dec. 2008
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper presents the design of a single rectangular microstrip patch antenna for operation at 2.4 GHz frequency on Radio Frequency (RF) antenna application using low temperature co-fired ceramic (LTCC) technology. LTCC is chosen as the substrate because of compactness and or being light-weight. It also offers high-speed and functionality for portable electronic devices used for wireless voice and data communication in rapidly expanding mobile network systems. The aim of this project was to design and simulate a microstrip patch antenna on the LTCC substrate call Ferro A6M tape operating at 2.4 GHz. Two microstrip patch antennas operating at 2.4 GHz was designed, and simulated; a rectangular microstrip patch antenna using LTCC technology has a length, L, 25.5 mm and a width, W, 34 mm and a rectangular microstrip patch antenna using printed circuit board (PCB) technology has a length, L, 28 mm and width, W, 37 mm. Those designs were simulated with Microwave Office software.
  • Keywords
    microstrip antennas; microwave antennas; printed circuits; Ferro A6M tape; PCB; frequency 2.4 GHz; low temperature co-fired ceramic technology; microstrip patch antenna; printed circuit board; radio frequency antenna; single rectangular patch antenna; size 25.5 mm; size 28 mm; size 34 mm; size 37 mm; Ceramics; Circuit simulation; Design engineering; Dielectric losses; Dielectric substrates; Feeds; Frequency; Microstrip antennas; Patch antennas; Temperature; Microstrip patch antenna; Microwave antennas; low temperature co-fired ceramic (LTCC); printed circuit board (PCB);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Design, 2008. ICED 2008. International Conference on
  • Conference_Location
    Penang
  • Print_ISBN
    978-1-4244-2315-6
  • Electronic_ISBN
    978-1-4244-2315-6
  • Type

    conf

  • DOI
    10.1109/ICED.2008.4786769
  • Filename
    4786769