DocumentCode
2772887
Title
Electrical characterization of a 64 Ball Grid Array package
Author
Boyer, Alexandre ; Sicard, Etienne ; Fer, Mathieu ; Courau, Lionel
Author_Institution
INSA, Univ. of Toulouse, Toulouse
fYear
2008
fDate
8-12 Sept. 2008
Firstpage
1
Lastpage
5
Abstract
This paper compares several measurement and simulation methods used to extract an electrical model of a 64 pin ball grid array package. This model is fundamental for electromagnetic interference analysis at integrated circuit level.
Keywords
ball grid arrays; electromagnetic interference; integrated circuit packaging; electrical characterization; electromagnetic interference analysis; integrated circuit level; pin ball grid array package; Circuit analysis; Circuit simulation; Electric variables measurement; Electromagnetic interference; Electromagnetic measurements; Electromagnetic modeling; Electronics packaging; Integrated circuit measurements; Integrated circuit modeling; Integrated circuit packaging; BGA; PEEC; TDR; VNA; on-package measurement; package modelling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
Conference_Location
Hamburg
Print_ISBN
978-1-4244-2737-6
Electronic_ISBN
978-1-4244-2737-6
Type
conf
DOI
10.1109/EMCEUROPE.2008.4786801
Filename
4786801
Link To Document