• DocumentCode
    2773869
  • Title

    Towards A QML Approach In Electronic Packaging

  • Author

    Dasgupta, A. ; Verma, S. ; Agarwal, R.K.

  • Author_Institution
    CALCE Electronic Packaging Research Center University of Maryland, College Park, MD 20742
  • fYear
    1992
  • fDate
    28-30 Sep 1992
  • Firstpage
    19
  • Lastpage
    29
  • Keywords
    Analytical models; Costs; Educational institutions; Electronic equipment testing; Electronics packaging; Manufacturing industries; Manufacturing processes; Product design; Pulp manufacturing; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
  • Print_ISBN
    0-7803-0755-0
  • Type

    conf

  • DOI
    10.1109/IEMT.1992.639856
  • Filename
    639856
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2773869