• DocumentCode
    2777772
  • Title

    Micromanipulators composed of Hinges and Links

  • Author

    Horie, Mikio ; Kamiya, Daiki

  • Author_Institution
    Tokyo Inst. of Technol., Yokohama
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    In the present paper, three kinds of manipulators are shown and their characteristics are discussed. Their manipulators are as follows, (1) a micromanipulator with flexural hinges for handling micro size objects, (2) a micromanipulator with large-deflective elastic hinges for microbonding by adhesives, and (3) a molding pantograph mechanism with large-deflective hinges, which is used as one component mechanism of a palmtop surface mount system using at the one room factory. In the case of the micromanipulator with flexural hinges, its micromanipulator had a good handling performance about glass balls whose diameter is 50 or 100 mum. In the case of the micro manipulator with large-deflective elastic hinges for microbonding by adhesives, a new bonding system of a slight amount of adhesives was found, and its good performance were confirmed in experiments. In the case of the molding pantograph mechanism with large-deflective hinges whose materials are polypropylene, it was confirmed that the hinge in the mechanism had not fractured even if more than one million repeatable motion of the mechanism in the mechanism´s fatigue test. Moreover, in order to have a long life hinge, the fatigue process toward the fracture of the hinge specimen was clarified in experiments by hinge-specimen´s fatigue test.
  • Keywords
    adhesives; bonding processes; fatigue testing; micromanipulators; pantographs; surface mount technology; adhesives; fatigue test; flexural hinges; large-deflective elastic hinges; micro size objects; microbonding; micromanipulators; molding pantograph mechanism; palmtop surface mount system; polypropylene; Fasteners; Fatigue; Fingers; Friction; Glass; Laboratories; Micromanipulators; Needles; Paper technology; Personal digital assistants;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430643
  • Filename
    4430643