• DocumentCode
    2778111
  • Title

    Microstrip Cross-coupled Trisection Bandpass Filters Fabricated on High Dielectric Constant Ceramic Substrates

  • Author

    Hsieh, Ming-Liang ; Chen, Lih-Shan ; Wang, Shuming ; Fu, Shen-Li

  • Author_Institution
    I-Shou Univ., Kaohsiung
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Miniaturized bandpass filters with sharp selectivity and low loss are required for wireless communication systems such as wireless local-area networks (WLAN). Since high permittivity dielectrics can reduce the size of bandpass filters, high dielectric constant ceramic materials are good candidates to prepare compact bandpass filters. In this work, a microstrip cross-coupled trisection bandpass filter was designed on high dielectric constant (Zn,Mg)TiO3 dielectrics, The center frequency of simulated results is 2.41 GHz and the bandwidth is 120 MHz, while that of the measured center frequency is 2.38 GHz and the bandwidth is 160 MHz. The simulated and measured insertion loss of the filters are -1.737 dB and -2.759 dB, respectively. The measured response of the fabricated filter is in agreement with the simulated results.
  • Keywords
    band-pass filters; dielectric materials; microstrip filters; permittivity; radiocommunication; substrates; Mg; TiO3; Zn; bandwidth 120 MHz; bandwidth 160 MHz; dielectric constant ceramic materials; dielectric constant ceramic substrates; frequency 2.38 GHz; frequency 2.41 GHz; high dielectric constant; high permittivity dielectrics; loss -1.737 dB; loss -2.759 dB; microstrip cross-coupled trisection bandpass filters; miniaturized bandpass filters; wireless communication systems; Band pass filters; Bandwidth; Ceramics; Dielectric loss measurement; Dielectric measurements; Dielectric substrates; Frequency; High-K gate dielectrics; Microstrip filters; Wireless communication; bandpass filter; dielectric constant; insertion loss;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430665
  • Filename
    4430665