DocumentCode
2779517
Title
IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)
fYear
2000
fDate
23-25 Oct. 2000
Abstract
The following topics were dealt with: system design; power distribution; measurements and emissions; modelling; RF/microwave packaging; and on-chip issues
Keywords
design engineering; integrated circuit design; modelling; packaging; power supply circuits; RF packaging; emissions; microwave packaging; modelling; on-chip issues; power distribution; system design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location
Scottsdale, AZ, USA
Print_ISBN
0-7803-6450-3
Type
conf
DOI
10.1109/EPEP.2000.895479
Filename
895479
Link To Document