DocumentCode
2779538
Title
Future interconnect requirements in high-speed switches for Internet backbones
Author
Luijten, Ronald P.
Author_Institution
IBM Res. Div., Ruschlikon, Switzerland
fYear
2000
fDate
2000
Firstpage
7
Lastpage
8
Abstract
Future packaging needs are projected from the perspective of a packet switch chip family. With the growth of bandwidth in the Internet, traditional copper-based intrabox transmission systems are running into limitations. Optics offer a solution, but the main challenge is to reduce the cost and establish appropriate standards
Keywords
Internet; integrated circuit interconnections; integrated circuit packaging; integrated optoelectronics; optical interconnections; packet switching; technological forecasting; Internet backbones; Internet bandwidth; copper-based intrabox transmission systems; cost reduction; high-speed switches; interconnect requirements; optics-based interconnects; packaging; packet switch; packet switch chips; standards; Bandwidth; Communication switching; Integrated circuit interconnections; Internet; Optical packet switching; Packaging; Packet switching; Pins; Power dissipation; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.
Conference_Location
Scottsdale, AZ
Print_ISBN
0-7803-6450-3
Type
conf
DOI
10.1109/EPEP.2000.895480
Filename
895480
Link To Document