Leveraging high density packaging for high performance DSP systems

Author

Mehrotra, Pronita ; Rao, Vikram ; Conte, Tom ; Franzon, Paul

Author_Institution

Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA

fYear

2000

fDate

2000

Firstpage

25

Lastpage

28

Abstract

The high connectivity of SHOCC (seamless high off-chip connectivity) technology can be exploited to increase the number of memory channels in a DSP system. This paper describes the physical and logical architecture of a high performance FFT system enabled by a combination of high density packaging and good memory management schemes, with an emphasis on signal integrity issues

Keywords

digital signal processing chips; fast Fourier transforms; integrated circuit interconnections; integrated circuit packaging; logic design; storage management; DSP system; FFT system; SHOCC technology; connectivity; high density packaging; high performance DSP systems; logical architecture; memory channels; memory management schemes; physical architecture; seamless high off-chip connectivity technology; signal integrity; Computer architecture; Crosstalk; Dielectric substrates; Digital signal processing; Engines; Packaging; Routing; Signal analysis; Synthetic aperture radar; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895485

Filename

895485