Modeling of irregular shaped power distribution networks using transmission matrix method

Author

Kim, Joong-Ho ; Swaminathan, Madhavan

Author_Institution

Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2000

fDate

2000

Firstpage

83

Lastpage

86

Abstract

This paper presents a method for analyzing irregular shaped power distribution networks. The planes are represented using a two dimensional array of transmission lines. The impedance is then computed using a 2N×2N transmission matrix, where N is the number of unit cells in the model. The results have been compared with SPICE for regular and irregular structures. The method is readily extendable to a third dimension and allows for the efficient computation of the power distribution impedance at specific points in the network

Keywords

SPICE; circuit analysis computing; impedance matrix; packaging; power supply circuits; transmission line matrix methods; 2D transmission line array; SPICE; impedance; irregular shaped power distribution networks; irregular structures; model unit cells; modeling; network plane representation; power distribution impedance; regular structures; transmission matrix; transmission matrix method; Computer networks; Conductors; Distributed computing; Equivalent circuits; Impedance; Packaging; Power distribution; Power systems; Resistors; Transmission line matrix methods;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.

Conference_Location

Scottsdale, AZ

Print_ISBN

0-7803-6450-3

Type

conf

DOI

10.1109/EPEP.2000.895498

Filename

895498